LIG Nex1’s Pangyo House facility | Image provided by LIG Nex1
LIG Nex1 announced that it recently signed a strategic memorandum of understanding (MOU) with BOS Semiconductors, a domestic fabless semiconductor company, to accelerate the development and commercialization of physical AI solutions for drones and robots.
BOS Semiconductors specializes in designing semiconductors for vehicles, robots, and physical AI. Through this agreement, the two companies will work closely to secure physical and on-device AI technologies that will drive innovation in next-generation intelligent drones and robotic systems.
Under the MOU, the partners plan to expand collaboration in areas including the development of physical AI semiconductors and drones and robots that apply them, as well as high-performance system-on-chip (SoC) solutions for next-generation drone and robot platforms.
Physical AI refers to technology in which AI models are embedded directly into devices, enabling them to perceive, decide, and act autonomously in physical environments. By reducing reliance on cloud-based computing and performing real-time perception, inference, and control on the device itself, physical AI minimizes latency while significantly improving security and power efficiency.
Because of these characteristics, physical AI is emerging as a core enabling technology for robots and drones that must operate autonomously in unmanned environments, and is widely regarded as a key paradigm for next-generation technologies.
Through this collaboration, LIG Nex1 and BOS Semiconductors aim to secure competitive capabilities in AI semiconductors and high-performance SoC-based technologies optimized for drone and robot platforms, and to lead the development of advanced intelligent unmanned systems across defense, industrial, logistics, and other sectors.
LIG Nex1 plans to advance the development of next-generation robot and drone systems by applying on-device AI semiconductors—key components for unmanned mobile platforms such as drones, robots, and humanoids. In addition to AI semiconductors, the company will jointly review with BOS Semiconductors the potential application of new platforms based on high-performance SoCs, further accelerating technological innovation in the unmanned systems domain.
